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Innovation in Applied MEMS Technology
 
 
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Prototype air control microvalves and driver units are currently available for research applications. As these applications are generally pre-production, units are delivered as part of a product development cooperative effort between iACTIV and the OEM. Please contact us for pricing information.

 

 

MEMS Packaging

Packaging includes the materials, the design used to encapsulate, protect and interface the MEMS device, and fabrication and assembly procedures.   Packaging remains a major obstacle to commercialization of MEMS devices. It can easily represent 80% of the cost of a component. iACTIV has extensive experience in the development of low cost MEMS packaging. We have the expertise and resources to provide  assistance in MEMS prototyping. Please contact us for more information.

www.iACTIVcorp.com | Contact Us | Updated 12 December 2005
Copyright ©2005  iACTIV Corporation. All rights reserved.

 

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iACTIV Corp.

4415 Euclid Ave.

Cleveland, OH.

44103-3733

 

(216)649-0399 p      

(216)649-0347 f
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